当前位置:科学网首页 > 基金首页 > 高温高湿条件下Sn-Ag-Cu系无铅焊点腐蚀失效机制研究

国家自然科学基金项目查询

高温高湿条件下Sn-Ag-Cu系无铅焊点腐蚀失效机制研究

批准号51601057 学科分类金属常温腐蚀与防护 ( E011101 )
项目负责人王明娜 负责人职称讲师 依托单位河北科技师范学院
资助金额20.00
万元
项目类别青年科学基金项目 研究期限2017 年 01 月 01 日 至
2019 年 12 月 31 日
中文主题词海洋大气环境;大气腐蚀;薄液膜;加速腐蚀试验;暴露实验
英文主题词Marine atmosphere environment;Atmospheric corrosion;Thin liquid film;Accelerated corrosion test;Exposure experiment

摘要

中文摘要 Sn-Ag-Cu(SAC)系无铅焊料作为传统Sn-Pb焊料的最佳替代品已被广泛应用于电子工业。焊点的可靠性保证电子设备的正常运转,南海环境高温高湿、风浪较大,对电子设备的环境适应性提出了更高的要求。本项目从以下三方面展开研究:1.对SAC305焊点进行微观表征,采用扫描开尔文探针显微镜(SKPFM)测试焊点金属间化合物Ag3Sn、Cu6Sn5的Volta电位,探讨微观结构对焊点微区腐蚀的影响。2.高温高湿条件下,采用SKPFM原位测试薄液膜下焊点腐蚀的发展,焊点/焊盘、焊点/引脚的电偶腐蚀,探讨焊点在高温高湿条件下的电化学腐蚀机理。3.通过环境扫描电镜和其配备的三点弯曲实验台,原位观察SAC305焊点在腐蚀与力学共同作用下的腐蚀开裂行为,探讨其在力学化学共同作用下的失效机制。本项目对阐明SAC305焊点在海洋环境的腐蚀失效机制有重要意义,为提高电子产品在海洋环境中的可靠性奠定基础。
英文摘要 Sn-Ag-Cu(SAC)lead-free solder alloys are considered as an alternative to Pb-containing solders, and they have been widely applied in the commercial microelectronic industry. In service, the reliability of solder joints is a key issue for the normal operation of electronic equipment. The electronic equipment requires a better environmental adaptability in corrosive environments, such as South China Sea with high-temperature and high-humidity atmosphere and large waves. The main contents of the project include three aspects: 1. Investigate the microstructures of SAC305 solder joint, and the Volta potentials of Ag3Sn、Cu6Sn5 phases are measured by scanning Kelvin probe force microscopy (SKPFM). The effects of microstructure of solder joint on local corrosion are discussed. 2. Under high-temperature and high-humidity condition, the corrosion of solder joint and the galvanic corrosion of solder joint/pad couple and solder joint/lead couple are in-situ observed by SKPFM. The electrochemical corrosion mechanism of solder joint is discussed. 3. The corrosion fracture behavior of SAC305 solder joint under combination of corrosion and mechanically applied stress was in-situ studied using environmental scanning electron microscopy equipped with the three-point bending stage. The failure mechanism of SAC305 lead-free solder joint under condition of the combination of corrosion and stress is discussed. The project is important to elucidate the interaction mechanism of service environment and SAC305 solder joint, and it is the foundation for the reliability evaluation of electronic products in actual service environment.
结题摘要

成果

序号 标题 类型 作者

关于我们| 网站声明| 服务条款| 联系方式| RSS| 中国科学报社 京ICP备14006957 京公网安备110402500057号
Copyright @ 2007- 中国科学报社 All Rights Reserved
地址:北京市海淀区中关村南一条乙三号   电话:010-62580783